Product Description
The Filmetrics R170 design is optimized for sheet resistance mapping on unpatterned semiconductor and compound semiconductor wafer applications such as Si and SiC substrates, epi layers, post-anneal ion implantation, and thin/thick metal layers. The R170 supports automated wafer handling for 200mm, 150mm, 125mm and 100mm wafers. It can also be configured for either contact four-point probe (4PP) measurement or non-contact eddy current (EC) measurement.
Features
- 4PP sheet resistance measurement spans a ten-decade range on conductive and semi-conductive films
- Resistor packs, NIST-traceable resistor packs and certified wafer standards for measurement accuracy
- Temperature correction for enhanced measurement stability
- Compatible with all KLA sheet resistance probes
- User-specified sample point mapping using rectangular, linear, polar, and custom configurations
- Fully automated measurements include wafer handling and SECS/GEM factory automation
- Offline software
Applications
- Bulk resistivity of silicon wafers
- Bulk resistivity of silicon carbide wafers
- Ion implantation process optimization
- Metal film uniformity
- CMP process uniformity
