Redefining Performance with Advanced Packaging
Advanced Packaging
Semiconductor packaging has evolved beyond protecting and connecting chips to powering device performance. Traditional transistor scaling continues, with packaging advancements further enhancing functionality. KLA’s experience solving front end yield challenges paired with our differentiated advanced packaging system portfolio make us an ideal partner for advancing connectivity in this expanding market.
Heterogeneous Integration
The key to advanced packaging is heterogeneous integration. Designers combine different chip technologies in one package to boost performance and efficiency. This approach marks a transition from a "system on a chip" to a "system of chips," where functions are distributed across multiple chips to meet specific device requirements.
Performance Through Packaging
The proliferation of AI and high-performance computing is driving demand for more powerful systems of chips, with capability made possible by innovative packaging technologies. Heterogeneous integration methods bring together multiple semiconductor components with potentially hundreds of logic and memory chips into a single high-value package for performance, power, connectivity and cost benefits.
Advanced packaging is crucial to device design and will continue to be an enabler as AI extends from cloud hyperscalers to mobile and edge devices.
Innovation Brings Manufacturing Challenges
Advanced packaging technology integrates multiple chips with increased interconnect density using intricate 2D and 3D architecture methods such as hybrid bonding, embedded bridges, interposers, glass core substrates, and eventually, co-packaged optics. These innovative integrations require an increased number of designs, larger die sizes, smaller features and novel materials, resulting in complex manufacturing challenges. Stricter process control will be essential to achieve high yield for these valuable packages.
KLA has expertise in yield management across front end semiconductors, packaging and IC substrates. This allows KLA to apply the precision of front-end process control to customized advanced packaging.
The KLA Advanced Packaging Portfolio
KLA offers a comprehensive portfolio of advanced packaging process control and process-enabling solutions for wafers, panels and components. Collaborating with semiconductor industry leaders to stay ahead of advanced packaging challenges, KLA helps manufacturers improve packaging yield and optimize chip performance.
KLA Highlights
Blog
From Sci Fi Movies to Semiconductors: A Journey in Artificial Intelligence
Apr 22, 2025
Pradeep Ramachandran’s 20-year adventure in artificial intelligence (AI) began during his undergraduate years at the Indian Institute of Technology when...
Advancing Connectivity with KLA’s New IC Substrate Product Portfolio
Dec 17, 2024
KLA is revamping its intelligent portfolio of solutions for IC substrates with several product updates. Advanced packaging continues to adopt...
Photolithography: What IC Substrate Manufacturers Need to Know
Dec 9, 2024
Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a...
Explore More Technology Trends
Artificial Intelligence
AI helps make sense of big data! Our solutions use AI to accelerate production of the very ICs that will power the next generation of AI innovation.
Automotive
The Internet of Things is expanding quickly, and the demand for smart devices is growing with it! Our solutions drive increasing production to match it.
IoT
The Internet of Things is expanding quickly, and the demand for smart devices is growing with it! Our solutions drive increasing production to match it.
5G Technology
5G is bringing higher data speeds and lower latency to the next generation of devices! Our solutions help ensure the necessary yield and reliability.