- Integrates review and analysis of data from all inspection, metrology and review systems
- Automates classification of defects detected by reticle inspectors
- Simulates wafer printability of defects detected by reticle inspectors
- Analyzes reticle haze and repair degradation during reticle requalification inspections
- Predicts wafer print impact through comprehensive analysis of aerial images of defects
- Classifies and simulates printability of EUV defects based on mask SEM images
- Provides alternate measurable sites at/around intended target locations on EUV masks for integrated LMS IPRO registration measurements
- Optimizes 193nm inspection source conditions for best defect sensitivity on EUV memory masks
- Models accurate e-beam images for use as a reference for single-die reticle repair
- Searches single-die design database for repeating patterns of a target site to be used as reference for repair disposition