Teron™ 6xx

Teron™ 6xx

Reticle Defect Inspection Systems for Mask Shop Applications

The Teron™ 640e reticle inspection product line advances the development and qualification of leading-edge EUV and 193nm patterned reticles in mask shops by detecting critical pattern and particle defects. Using die-to-database or die-to-die modes, these inspection systems are designed to handle the wide range of stack materials and complex OPC structures characteristic of the latest 7nm and 5nm device nodes. The Teron 640e incorporates several optics and image processing enhancements that support the defect capture specifications and throughput required to accelerate reticle manufacturing cycle times. The Teron 640e product line also achieves the stringent cleanliness requirements necessary for production of EUV masks.

Teron™ SL6xx

Teron™ SL6xx

Reticle Defect Inspection Systems for IC Fab Applications

The Teron™ SL670e XP inspection system is used to assess incoming EUV reticle quality and to re-qualify EUV reticles periodically during production use and after reticle cleaning, helping chipmakers protect yield by reducing the risk of printing defective wafers. With innovative EUVGold™ and EUVMultiDie technologies, advanced focus tracking, and imaging flexibility, the Teron SL670e XP delivers the sensitivity required to monitor and detect yield-critical reticle defects on EUV reticles used for 5nm/3nm logic and advanced DRAM chip production. The Teron SL670e XP also has industry-leading production throughput, supporting the fast cycle times needed to qualify reticles during high-volume chip manufacturing. Inspection of advanced optical reticles is supported on the Teron SL670e XP with an option.

FlashScan^®

FlashScan^®

Reticle Blank Defect Inspection Systems

The FlashScan^® 211 mask blank defect inspection system supports mask shops and blank manufacturers in meeting mask blank defect requirements for optical and EUV lithography applications. The FlashScan 211 system pairs its high sensitivity with unparalleled inspection speed and automatic defect dispositioning, reducing the time to results for a wide range of applications.

LMS IPRO

LMS IPRO

Reticle Pattern Registration Metrology Systems

The LMS IPRO7 reticle registration metrology system is designed to provide accurate and fast verification of the pattern placement performance on EUV and optical reticles for the 7nm design node. By offering comprehensive characterization of reticle pattern placement error, the LMS IPRO7 produces data used for e-beam mask writer corrections and reticle quality control during the development and production of advanced design node reticles. Using KLA’s proprietary model-based metrology algorithm, the LMS IPRO7 measures pattern placement error for both targets and multiple on-device pattern features with high accuracy, enabling characterization and reduction of reticle-related contributions to device overlay errors in the IC fab.

MaskTemp™ 2

MaskTemp™ 2

In Situ Reticle Temperature Measurement System

The MaskTemp™ 2 in situ reticle temperature measurement system is used by mask shops for qualification and monitoring of e-beam writers and high temperature reticle process steps. The MaskTemp 2 serves a key role in the qualification of e-beam mask writers as extreme temperature stability is required over the extended time period (up to 24 hours) required to completely write a mask. Inside the e-beam mask writer, the MaskTemp 2 collects temperature data for 24 consecutive hours, providing mask manufacturers with the data needed to ensure the thermal stability of the system prior to writing critical masks. The Mask Temp 2 also supports post-exposure bake characterization, hot plate temperature uniformity monitoring, hot plate matching, and other high temperature process applications, helping mask manufacturers identify and reduce post-write process thermal variations that affect final reticle quality.

Klarity^®

Klarity^®

Automated Defect and Yield Data Analysis

Klarity^® Defect automated defect analysis and data management system helps fabs achieve faster yield learning cycles through real-time excursion identification. Klarity^® SSA (Spatial Signature Analysis) analysis module for Klarity Defect provides automatic detection and classification of defect signatures that indicate process issues. Klarity^® ACE XP advanced yield analysis system helps fabs capture, retain and share yield learning within and across fabs for yield acceleration. Klarity systems utilize an intuitive decision flow analysis, allowing engineers to easily create customized analyses that support applications such as lot dispositioning, review sampling, defect source analysis, SPC setup and management, and excursion notifications. Klarity Defect, Klarity SSA and Klarity ACE XP form a fab-wide yield solution that automatically reduces defect inspection, classification and review data to relevant root-cause and yield-analysis information. Klarity data helps IC, packaging, compound semi and HDD manufacturers take corrective action sooner, resulting in accelerated yield and better time to market.

RDC

RDC

Reticle Data Analysis and Management

The RDC (Reticle Decision Center) comprehensive data analysis and management system supports multiple KLA reticle inspection and metrology platforms for reticle qualification. RDC provides a wide array of applications that drive automated defect disposition decisions, improve cycle time and reduce the reticle-related patterning errors that can affect yield. In addition to providing critical applications, RDC serves as a central data management system utilizing a high reliability, flexible server configuration.