Reticle Manufacturing

Reticle Manufacturing

An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.

Categories

Teron™ 6xx

Interested in this product or have questions?
Contact Us

Teron™ 6xx

Reticle Defect Inspection Systems for Mask Shop Applications

The Teron™ 640e reticle inspection product line advances the development and qualification of leading-edge EUV and 193nm patterned reticles in mask shops by detecting critical pattern and particle defects. Using die-to-database or die-to-die modes, these inspection systems are designed to handle the wide range of stack materials and complex OPC structures characteristic of the latest 7nm and 5nm device nodes. The Teron 640e incorporates several optics and image processing enhancements that support the defect capture specifications and throughput required to accelerate reticle manufacturing cycle times. The Teron 640e product line also achieves the stringent cleanliness requirements necessary for production of EUV masks.

Applications
Reticle qualification, Reticle process control, Reticle process equipment monitoring, Outgoing reticle quality check
Related Products

Teron 640: Industry production standard for inspection of optical and EUV reticles at the 10nm node and beyond.

Teron 630: Industry production standard for inspection of 1Xnm / 2XHP optical and EUV reticles.

Teron 610: Industry production standard for inspection of 2Xnm / 3XHP optical reticles.

TeraScan 500XR: Industry production standard for inspection of 3Xnm / 4XHP optical reticles.

Interested in this product or have questions?
Contact Us

Teron™ SL6xx

Interested in this product or have questions?
Contact Us

Teron™ SL6xx

Reticle Defect Inspection Systems for IC Fab Applications

The Teron™ SL670e XP inspection system is used to assess incoming EUV reticle quality and to re-qualify EUV reticles periodically during production use and after reticle cleaning, helping chipmakers protect yield by reducing the risk of printing defective wafers. With innovative EUVGold™ and EUVMultiDie technologies, advanced focus tracking, and imaging flexibility, the Teron SL670e XP delivers the sensitivity required to monitor and detect yield-critical reticle defects on EUV reticles used for 5nm/3nm logic and advanced DRAM chip production. The Teron SL670e XP also has industry-leading production throughput, supporting the fast cycle times needed to qualify reticles during high-volume chip manufacturing. Inspection of advanced optical reticles is supported on the Teron SL670e XP with an option.

Applications
Reticle re-qualification, Incoming reticle quality check
Related Products

Teron™ SL670e: Inspection of EUV and optical (optional) reticles during chip manufacturing for 7nm/5nm design node IC technologies.

Teron™ SL655: Inspection of optical and EUV (optional) reticles during chip manufacturing for 10nm design node IC technologies.

Teron™ SL650: Inspection of optical reticles during chip manufacturing for 20nm design node IC technologies.

X5.3™: Inspection of non-critical reticles during chip manufacturing for ≥20nm design node IC technologies.

RA (Reticle Analyzer): Reticle data analytics system for IC fabs supports applications such as automatic defect classification, lithography plane review and defect progression monitoring.

Interested in this product or have questions?
Contact Us

FlashScan®

Interested in this product or have questions?
Contact Us

FlashScan®

Reticle Blank Defect Inspection Systems

The FlashScan® 211 mask blank defect inspection system supports mask shops and blank manufacturers in meeting mask blank defect requirements for optical and EUV lithography applications. The FlashScan 211 system pairs its high sensitivity with unparalleled inspection speed and automatic defect dispositioning, reducing the time to results for a wide range of applications.

Applications
Mask blank manufacturing, Mask blank qualification, Reticle process control, Reticle process equipment monitoring
Interested in this product or have questions?
Contact Us

LMS IPRO

Interested in this product or have questions?
Contact Us

LMS IPRO

Reticle Pattern Registration Metrology Systems

The LMS IPRO7 reticle registration metrology system is designed to provide accurate and fast verification of the pattern placement performance on EUV and optical reticles for the 7nm design node. By offering comprehensive characterization of reticle pattern placement error, the LMS IPRO7 produces data used for e-beam mask writer corrections and reticle quality control during the development and production of advanced design node reticles. Using KLA’s proprietary model-based metrology algorithm, the LMS IPRO7 measures pattern placement error for both targets and multiple on-device pattern features with high accuracy, enabling characterization and reduction of reticle-related contributions to device overlay errors in the IC fab.

Applications
Reticle qualification, Outgoing reticle quality check, Mask writer qualification and monitoring, Reticle process monitoring, Wafer patterning control
Related Products

LMS IPRO6: Mask metrology system for the 10nm design node, supporting measurement on both standard registration marks and on-device pattern features.

LMS IPRO4: Mask metrology system for the 32nm/28nm design nodes. With industry-unique flexible handling capability, the LMS IPRO4 supports mask sizes from 4” to 8”. Click the Contact Us button for more information about new and refurbished systems.

Interested in this product or have questions?
Contact Us

MaskTemp™ 2

Interested in this product or have questions?
Contact Us

MaskTemp™ 2

In Situ Reticle Temperature Measurement System

The MaskTemp™ 2 in situ reticle temperature measurement system is used by mask shops for qualification and monitoring of e-beam writers and high temperature reticle process steps. The MaskTemp 2 serves a key role in the qualification of e-beam mask writers as extreme temperature stability is required over the extended time period (up to 24 hours) required to completely write a mask. Inside the e-beam mask writer, the MaskTemp 2 collects temperature data for 24 consecutive hours, providing mask manufacturers with the data needed to ensure the thermal stability of the system prior to writing critical masks. The Mask Temp 2 also supports post-exposure bake characterization, hot plate temperature uniformity monitoring, hot plate matching, and other high temperature process applications, helping mask manufacturers identify and reduce post-write process thermal variations that affect final reticle quality.

Applications
e-Beam mask writer qualification, Process development, Process control, Process qualification, Process monitoring, Process tool qualification, Process tool matching

e-Beam mask write | 20-40°C
Post-exposure bake | 20-140°C
Interested in this product or have questions?
Contact Us

Klarity®

Interested in this product or have questions?
Contact Us

Klarity®

Automated Defect and Yield Data Analysis

Klarity® Defect automated defect analysis and data management system helps fabs achieve faster yield learning cycles through real-time excursion identification. Klarity® SSA (Spatial Signature Analysis) analysis module for Klarity Defect provides automatic detection and classification of defect signatures that indicate process issues. Klarity® ACE XP advanced yield analysis system helps fabs capture, retain and share yield learning within and across fabs for yield acceleration. Klarity systems utilize an intuitive decision flow analysis, allowing engineers to easily create customized analyses that support applications such as lot dispositioning, review sampling, defect source analysis, SPC setup and management, and excursion notifications. Klarity Defect, Klarity SSA and Klarity ACE XP form a fab-wide yield solution that automatically reduces defect inspection, classification and review data to relevant root-cause and yield-analysis information. Klarity data helps IC, packaging, compound semi and HDD manufacturers take corrective action sooner, resulting in accelerated yield and better time to market.

Applications

Defect data analysis, Wafer disposition, Process and tool excursion identification, Spatial signature analysis, Yield analysis, Yield prediction

Interested in this product or have questions?
Contact Us

RDC

Interested in this product or have questions?
Contact Us

RDC

Reticle Data Analysis and Management

The RDC (Reticle Decision Center) comprehensive data analysis and management system supports multiple KLA reticle inspection and metrology platforms for reticle qualification. RDC provides a wide array of applications that drive automated defect disposition decisions, improve cycle time and reduce the reticle-related patterning errors that can affect yield. In addition to providing critical applications, RDC serves as a central data management system utilizing a high reliability, flexible server configuration.

Interested in this product or have questions?
Contact Us

Ready to get started?

Contact Us

Are you sure?

You've selected to view this site translated by Google Translate.
KLA China has the same content with improved translations.

Would you like to visit KLA China instead?


您已选择查看由Google翻译翻译的此网站。
KLA中国的内容与英文网站相同并改进了翻译。

你想访问KLA中国吗?

If you are a current KLA Employee, please apply through the KLA Intranet on My Access.

Exit