Logic/memory, MEMS, Photovoltaic, IC substrate (ICS), Panel-level packaging, PCB, Solar, HDD
Chemistry Process Control
KLA’s chemistry process control products support multiple applications within the printed circuit board (PCB) and IC substrate manufacturing environments, including analysis and monitoring of plating and coating chemistries. Analysis systems use a patented cyclic voltametric stripping (CVS) technique to analyze PCB plating baths to help ensure optimal plating. Systems test the quality of metallization on plated components or wires, helping PCB manufacturers ensure readiness for solder and wirebond. Chemical management systems enable online monitoring and control for plating processes during high volume manufacturing of IC substrates and PCBs. The information produced by these chemistry process control systems allows PCB and IC substrate manufacturers to optimize processes and achieve higher yield.
Choose Language:
English
Quali-Fill® Libra®
Online Chemical Management System for Plating
The Quali-Fill® Libra® system is a standalone metrology analyzer for electroplating and electroless deposition, for semiconductor advanced packaging, solar and hard disk drive manufacturing. The modular system supports the chemical metrology performance required for ultra-safe and ultra-clean wafer and panel fabrication by accurate analysis of main bath components and detecting and quantifying contaminants like photoresist, additive breakdown products and trace foreign metals. It meets all semiconductor safety and communications guidelines while monitoring plating chemicals used for wafer-level and panel-level packaging processes. The addition of Quali-Fill® Libra® KT100 provides elemental composition details from inductively coupled plasma optical emission spectroscopy (ICP-OES) for the most detailed breakdown. Paired with Quali-Dose®, it provides users with closed-loop, flexible, precise dosing to manage the quality of plated products.
Through-silicon via (TSV), Redistribution layer (RDL), Under bump metallization (UBM) and Micro bumping for Cu, Ni, SnAg and Au, Desmear, Eless prep, Electroless metallization for Cu, Pd, Ni, Au
Quali-Fill® Libra® KT100
Online chemical management of metal contaminants in ppb/ppm level using ICP-OES.
Quali-Dose®
Standalone dosing system with multiple dosing schemes for plating bath control.
QualiSurf®
Online Chemical Monitoring System for Wet Etch/Clean Chemistries in Advanced Packaging
The QualiSurf® chemical monitoring system supports advanced cleaning and wet etching applications in advanced wafer-level and panel-level packaging processes to minimize waste from non-optimal chemistries. Formulated for both chemical components, and etched products or process contaminants (for reclaimed chemicals), it provides powerful insights based on more than 15 integrated analytical methods, including spectral, electrochemical and titration methods. The QualiSurf online metrology system precisely monitors and controls each packaging manufacturing process and chemistry, with high accuracy and repeatability, ensured by auto calibration, validation and a self-analyzer health check.
Under bump metallization (UBM) etch for Cu, Sn, Ti or TiW, Photoresist (PR) removal
QualiSurf® W100 Series
Online metrology to analyze under bump metallization (UBM) etch to reclaim or reuse chemicals without quality issues.
QualiSurf® W200 Series
Online metrology to analyze photoresist (PR) removal to reclaim or reuse chemicals without quality issues.
The QualiLab Elite® benchtop lab instruments support chemistry analysis for evolving industry technologies and university applications.
Click here to learn moreAre you sure?
You've selected to view this site translated by Google Translate.
KLA China has the same content with improved translations.
Would you like to visit KLA China instead?
您已选择查看由Google翻译翻译的此网站。
KLA中国的内容与英文网站相同并改进了翻译。
你想访问KLA中国吗？
If you are a current KLA Employee, please apply through the KLA Intranet on My Access.