Printed Circuit Board and IC Substrate Manufacturing

Printed Circuit Board and IC Substrate Manufacturing

KLA’s advanced process control and process enabling solutions support printed circuit board (PCB) and integrated circuit substrate (ICS) manufacturing. Manufacturers can manage yield and reliability throughout the fabrication process using KLA’s comprehensive portfolio of direct imaging for patterning and solder mask, automated optical inspection (AOI), automated optical shaping (AOS), UV laser drilling, inkjet and additive printing, chemistry process control as well as software solutions. From multi-layer boards to the most advanced IC substrate applications, our solutions enable manufacturers to build high-capacity, high-quality, high-precision PCB and IC substrate products while optimizing their productivity and cost-efficiency.

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