Solder mask additive printing
Inkjet and Additive Printing
KLA’s portfolio of inkjet and additive printing systems are digital solutions designed to replace conventional and lengthy processes for printed circuit boards, flexible printed circuits, IC substrates and packaging applications. Our solutions provide manufacturers high throughput and productivity at low operational costs, with precise drop placement and optimized algorithms for fine features and 3D-like structures, such as dams. Our solutions contain multiple LED-based UV curing, specially optimized print heads and intelligent algorithms designed specifically to meet the challenges of the electronics industry processes and substrates. The unique mix of these technologies ensures consistently fast and precise printing on even the most challenging of topographies and substrates.
Choose Language:
English
Orbotech Neos™ Series
Solder Mask Inkjet Printer
The Orbotech Neos™ additive printing series is an efficient, eco-friendly solution for solder mask (SM) layer printing. Powered by KLA’s innovative Structural Printing™ technology and field-proven DotStream Pro™ technology, the Orbotech Neos solution simplifies SM printing and significantly cuts time to market. Based on an intelligent self-maintenance platform, the Orbotech Neos inkjet solution ensures consistent quality and reliability of the SM layer, while enabling a decreased total cost of ownership (TCO).
Orbotech Sprint™
Inkjet Printing for PCB Legends
The Orbotech Sprint™ series of inkjet printing systems is powered by DotStream™ Pro technology to deliver cost-effective, high-quality industrial inkjet printing for consistently accurate production of even the most advanced legend designs at any manufacturing volume. These systems contain LED-based UV curing and specially optimized print heads that meet the challenges of the varying substrates and processes across the electronics industry. Patented technologies for self-maintenance and ink cycle control reduce costs by significantly extending print head life, while the built-in air scrubber ensures a consistently clean printing environment. The Orbotech Sprint series delivers high yield with low total cost of ownership (TCO).
Rigid, rigid-flex and flex PCBs, PCB legends
Orbotech Sprint 300
PCB legend inkjet printer that can handle multiple panels and enable serialization for up to three levels, with high-speed printing of fine features as small as 60µm 2D barcode cell sizes, 65µm lines and 0.25mm text.
Orbotech Sprint 300 Flex
PCB legend inkjet printer that can handle multiple flex panels and enable serialization for up to three levels, with high-speed printing of fine features as small as 60µm 2D barcode cell sizes, 65µm lines and 0.25mm text.
Orbotech Sprint 200S
PCB legend inkjet printer that enables increased throughput of more than 100 prints per hour, supporting multi-panel, multi-level serialization, as well as multi-alignment that enables partial scaling registration and on-the-fly alignment.
Orbotech Sprint 200
PCB legend inkjet printer that achieves nearly full ink coverage in a single pass with precise drop placement and optimized algorithms for fine text and filled areas.
Orbotech Sprint 200 Flex
PCB legend inkjet printer that meets the unique requirements of mass production flexible PCBs.
Orbotech Sprint 150
PCB legend inkjet printer that achieves nearly full ink coverage in two passes with precise drop placement and optimized algorithms for fine text and filled areas.
Orbotech Magna™
Additive Printing for IC Packaging
The Orbotech Magna™ additive printing system delivers high-quality, high-accuracy and high-productivity printing at a low total cost of ownership (TCO). It is designed to print dams for flip-chip chip scale package (FCCSP), ball grid array (BGA) and advanced system in package (SiP) modules, enabling manufacturers to save space and costs when preventing underfill leakage by depositing a protective barrier to seal off the surrounding die area. The Orbotech Magna system also enables selective insulation layer printing such as routable quad flat no-lead package (QFN), IC substrates and more. This eliminates expensive lithography steps, simplifies the conventional process and reduces operational costs, enabling a faster ramp-up and time to market for new microelectronics.
IC substrates, Flip-chip chip scale package (FCCSP), Ball grid array (BGA), Advanced system in package (SiP) modules, IC packaging
Orbotech Jetext™
Inkjet Printing for Package Marking
The Orbotech Jetext™ inkjet printing system offers a safe and smart CAM-ready (computer-aided manufacturing) alternative for legend and 2D barcode package marking that eliminates the risk of damage from heat or contact. Powered by DotStream Pro™ technology, it delivers precise and uniform material deposition on the most challenging, uneven surfaces with accurate pattern alignment and high-speed, high-contrast, fine-feature printing. With the growing importance of package miniaturization, inkjet printing is a preferred process alternative to laser ablation for marking devices for traceability purposes.
Advanced IC packaging, Package marking, Traceability
Are you sure?
You've selected to view this site translated by Google Translate.
KLA China has the same content with improved translations.
Would you like to visit KLA China instead?
您已选择查看由Google翻译翻译的此网站。
KLA中国的内容与英文网站相同并改进了翻译。
你想访问KLA中国吗？
If you are a current KLA Employee, please apply through the KLA Intranet on My Access.