Inspection and Metrology

KLA’s portfolio of process control solutions for the PCB manufacturing environment includes both automated optical inspection (AOI) systems for advanced defect inspection and panel metrology systems for 3D and 2D measurements. The AOI systems allow PCB and IC substrate manufacturers to find, identify and classify defects on any kind of PCB, including complex applications like semi-additive processes (SAP/mSAP), high-density interconnect (HDI), any-layer and flip-chip structures. The multi-mode metrology systems enable a wide range of measurement applications for both test and inline panels. The resulting critical inspection and metrology information, augmented by artificial intelligence (AI) and machine learning (ML), allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.

Orbotech Ultra Dimension™

Automated Optical Inspection (AOI)

The Orbotech Ultra Dimension™ series of automated optical inspection systems is changing the AOI room workflow for advanced PCB production, including substrate-like PCBs (SLP), modified semi-additive process (mSAP), advanced high-density interconnect (HDI), advanced flex and IC substrates. Built to meet evolving requirements for higher quality, greater yield and lower total cost of ownership (TCO), the Orbotech Ultra Dimension series fully integrates best-in-class pattern inspection, laser via (LV) inspection, remote multi-image verification pro (RMIV Pro) and 2D metrology into a single system. Triple Vision™ technology integrates images from three channels into a single multicolor image, enabling operators to accurately differentiate between real and false defects in under one second. State-of-the-art algorithms in KLA’s Magic™ technology removes the need to use inspection masks that can cause defects to be missed.

Orbotech Ultra Fusion™

Automated Optical Inspection (AOI)

The Orbotech Ultra Fusion™ series of automated optical inspection systems delivers leading-edge AOI performance for advanced IC substrate production. Featuring powerful Multi-Image™ technology, the systems achieve the highest levels of detection accuracy and operational efficiency required for successful production of today’s complex applications, such as semi-additive processes (SAP/mSAP), high-density interconnect (HDI), any-layer and flip-chip structures. Using unique wavelengths of light from different angles to perform inspections, the Orbotech Ultra Fusion systems reduce defect false alarms by up to 70% compared to conventional AOI systems and reveal details unseen by other systems.

Orbotech Fusion™

Automated Optical Inspection (AOI)

The Orbotech Fusion™ series of automated optical inspection systems use breakthrough Multi-Image™ technology to inspect panels multiple times in one scan for unparalleled detection accuracy and the lowest false alarm level. The Multi-Image technology reduces false alarms by up to 70% compared to conventional AOI. The systems perform inspections using different lights and different angles with a combination of red and blue color illumination channels to reveal details unseen by other systems. Designed for HDI and flex PCB applications, the series redefines PCB production efficiency, while achieving a low cost per scan.

Orbotech Discovery™ II

Automated Optical Inspection (AOI)

The Orbotech Discovery™ II series of automated optical inspection systems delivers new AOI capabilities for greater operational efficiency. The systems ensure high defect detection and low false alarms using field-proven SIP™ technology, while providing full flexibility to handle today’s challenging high-density interconnect (HDI), flex PCB, multi-layer board (MLB) and quick turnaround (QTA) mass production requirements. KLA’s Smart Setup™ transforms the traditional AOI setup process to a single cycle with minimized process steps, creating greater efficiency and lower cost of operation.

ICOS T890

Packaged IC and Singulated Substrate Inspection and Metrology Systems

The ICOS T890 component inspector provides high-performance, fully automated optical inspection of packaged integrated circuit (IC) components and singulated IC substrates. The system provides accurate and repeatable 3D metrology and high sensitivity advanced visual inspection (AVI) for 6-sided defect detection to determine final package quality for a wide range of device types and sizes. The ICOS T890 offers parallel operation of four independent inspection stations and a component sorting station, achieving high throughput, cost-effective component inspection.

Zeta™-6x0

Panel Metrology System for PCB and IC Substrates

The Zeta™-6x0 panel metrology system addresses 3D and 2D metrology requirements for PCB and IC substrate manufacturing. Based on a multi-mode approach to measurements, the Zeta-6x0 optical profiler system combines the capability of several tools into one compact platform, capable of measuring a variety of applications such as via and trace dimensions, bump dimensions, overlay, film thickness, roughness and panel warpage. Additionally, the system has an option to integrate a panel inspection module for macro defect inspection and full panel image acquisition. The Zeta-6x0 Series profiler measures both test and inline product panels, providing the data required to enable process feedback during development and to support process control for high volume manufacturing.

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