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Enabling 5G Connectivity

5G generates greater demand for higher quality, reliable electronics

How KLA enables 5G

5G delivers much more than a faster browsing experience to your mobile device. 5G networking technology is critical to enabling how independent systems interact synergistically with each other. Coupled with innovations in artificial intelligence (AI), 5G is changing how our world works, how we communicate, and how information flows in business and our personal lives. For example, automobile vehicle to everything (V2X) communication technology utilizes 5G to improve safety and help with traffic management by constantly monitoring and communicating with the surroundings. In addition, KLA’s technologies enable the manufacture of thinner and lighter advanced displays that are an essential part of many 5G devices.

KLA’s products are used at every stage in the 5G component manufacturing process, from R&D through high-volume production of ICs, packages and PCBs, to ensure the highest quality and reliability standards are achieved.

KLA Products

Integrated Circuit Quality

Semiconductor IC quality is fundamental to the success of mission-critical, low‐latency 5G services such as autonomous driving and security monitoring. High chip reliability and performance are achieved through implementation of comprehensive process control strategies across the semiconductor ecosystem.

IC Process Control

Packaging Inspection

Compound Semi Process Control

Semiconductor Manufacturing

5G applications are driving increased adoption of electronic devices that utilize RF power amplifiers and high-frequency filters, sensors and MEMS devices. Robust IC process technologies and process control strategies improve chip performance and reliability.

Process Solutions

Plasma Dicing

Packaging Advances

New IC packaging architectures with complex levels of integration—system in package (SiP) and fan-out on both wafer and panel—enable the development of 5G devices. Process technologies, including etch, PVD, CVD, and UV laser drilling support the formation of these complex packaging schemes. During packaging processing and after component formation, tighter quality requirements drive the need for accurate inspections at the wafer, die and sub-package levels.

Component Inspection

Wafer-Level Packaging (WLP) Inspection

Packaging Processing

High Density Interconnect PCB

5G-enabled devices require advanced printed circuit boards with finer linewidths, straight sidewall geometry and multiple layers with more stringent quality and reliability requirements. PCB inspection, repair and imaging systems help manufacturers find and repair defective layers and trace the source of defects, increasing the yield and reliability of finished PCBs.

PCB Inspection

PCB Repair

PCB Imaging

Learn how our products can help you achieve more.

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5G Commentary

Semiconductor Engineering / Jan 2022
Inspecting And Testing GaN Power Semis

Semiconductor Engineering / Jan 2022
The Gargantuan 5G Chip Challenge

SPTS Webinar / Dec 2021
Filtering for 5G – AlScNand Electrode Metal Deposition for Advanced BAW Filters

Semiconductor Engineering / Aug 2021
Designing Chips For Test Data

Semiconductor Engineering / Jul 2021
Chip Shortages Grow For Mature Nodes

Semiconductor Engineering / May 2021
Advanced Packaging’s Next Wave

Semiconductor Engineering / Mar 2021
What Goes Wrong In Advanced Packages

Semiconductor Engineering / Jan 2021
The Good, Bad And Unknowns Of Flexible Devices

Semiconductor Engineering / Dec 2020
Variation Threat In Advanced Nodes, Packages Grows

Semiconductor Engineering / Dec 2020
200mm Demand Surges

Semiconductor Engineering / Oct 2020
Defect Challenges Grow For IC Packaging

Semiconductor Engineering / Apr 2020
Scaling CMOS Image Sensors

SPTS Webinar / Dec 2019
Challenges in Dry Etching of AlN& AlScNfor BAW Filters

Semiconductor Engineering / Dec 2019
The Growing Challenges of 5G Reliability

Semiconductor Engineering / Jul 2019
Challenges Grow For 5G Packages And Modules

Orbotech blog / Jun 2018
High-frequency 5G wireless infrastructure requires a new approach to PCB manufacturing

Orbotech blog / May 2018
Brainstorm: how are manufacturers preparing for 5G

Orbotech blog / Oct 2017
mSAP: The New PCB Manufacturing Imperative for 5G Smartphones

Explore More Solutions

Artificial Intelligence

AI helps make sense of big data! Our solutions use AI to accelerate production of the very ICs that will power the next generation of AI innovation.

Learn more

IoT

The Internet of Things is expanding quickly, and the demand for smart devices is growing with it! Our solutions drive increasing production to match it.

Learn more

Automotive

Navigation, infotainment, driver assistance, autonomous driving, flying cars! Our solutions revolutionize quality control for the ICs that power the future of automotive.

Learn more

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