Solar wafer process monitoring, Tool monitoring, Solar wafer sorting
Solar Manufacturing
Solar electricity generation is playing an increasingly important role in the global move toward more environmentally friendly energy sources. With photovoltaic (PV) devices being the fundamental building blocks in the solar revolution, achieving high-quality, high-volume PV manufacturing is a key element for success. Deploying process control systems and strategies throughout the solar fab line is essential for helping solar cell manufacturers improve efficiency, yield, and thus, overall profitability.
MicroSense® PV-6060
Non-Contact Photovoltaic Measurement Module
The MicroSense® PV-6060 photovoltaic metrology module offers high accuracy and unparalleled throughput for inline measurement of solar wafer thickness, wafer total thickness variation (TTV) and wafer resistivity. With high stability and low noise, the MicroSense PV-6060’s advanced, non-contact capacitive sensors provide sub-micron resolution and repeatable thickness measurements. The MicroSense PV-6060 system has a modular design for simple, flexible integration into automated wafer transports for use by OEMs manufacturing inline solar wafer inspection and sorting systems.
Quali-Fill® Libra®
Online Chemical Management System for Plating
The Quali-Fill® Libra® system is a standalone metrology analyzer for electroplating and electroless deposition, for semiconductor advanced packaging, solar and hard disk drive manufacturing. The modular system supports the chemical metrology performance required for ultra-safe and ultra-clean wafer and panel fabrication by accurate analysis of main bath components and detecting and quantifying contaminants like photoresist, additive breakdown products and trace foreign metals. It meets all semiconductor safety and communications guidelines while monitoring plating chemicals used for wafer-level and panel-level packaging processes. The addition of Quali-Fill® Libra® KT100 provides elemental composition details from inductively coupled plasma optical emission spectroscopy (ICP-OES) for the most detailed breakdown. Paired with Quali-Dose®, it provides users with closed-loop, flexible, precise dosing to manage the quality of plated products.
Logic/memory, MEMS, Photovoltaic, IC substrate (ICS), Panel-level packaging, PCB, Solar, HDD
Through-silicon via (TSV), Redistribution layer (RDL), Under bump metallization (UBM) and Micro bumping for Cu, Ni, SnAg and Au, Desmear, Eless prep, Electroless metallization for Cu, Pd, Ni, Au
Quali-Fill® Libra® KT100
Online chemical management of metal contaminants in ppb/ppm level using ICP-OES.
Quali-Dose®
Standalone dosing system with multiple dosing schemes for plating bath control.
Quali-Line® Prima®
Online Chemical Management System for Copper Damascene
The Quali-Line® Prima® 2 system analyzes and controls copper damascene processes for plating advanced nodes. Developed for advanced chip, solar and hard disk drive manufacturing at high-volume, the chemical monitoring system for Cu interconnects supports conventional, ultra-low and high Cu concentration chemistries and facilitates accurate Cu plating for semiconductor devices. The Quali-Line Prima 2 system is easily combined with advanced plating tools and provides fast analysis and precise control to discover inorganic and organic components with optimal accuracy and repeatability.
Cu interconnects, Damascene processes, Plating
Quali-Line® Prima
Online chemical management of Cu damascene process
Are you sure?
You've selected to view this site translated by Google Translate.
KLA China has the same content with improved translations.
Would you like to visit KLA China instead?
您已选择查看由Google翻译翻译的此网站。
KLA中国的内容与英文网站相同并改进了翻译。
你想访问KLA中国吗？
If you are a current KLA Employee, please apply through the KLA Intranet on My Access.