IC Component Inspection and Metrology

IC Component Inspection and Metrology

KLA’s packaged component inspection and metrology systems characterize key features of advanced and traditional package types with varying size and interconnect styles. Our systems provide sensitivity to a variety of defect types as well as accurate and repeatable 3D metrology measurements, which together provide packaging manufacturers the data required to improve their yield while effectively sorting components so that defective parts are quickly removed. By providing flexible systems capable of handling a large variety of package types, engineers can further increase overall operational effectiveness in a dynamic manufacturing environment.

ICOS T3/T7

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ICOS T3/T7

Packaged IC Inspection and Metrology Systems

The ICOS T3/T7 Series delivers multiple options for fully automated optical inspection of packaged integrated circuit (IC) components with tray (T3) or tape (T7) output. The ICOS T3/T7 Series provides increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of issues that affect final package quality. For the most accurate component sorting process, the ICOS T3/T7 Series utilizes Artificial Intelligence (AI) systems with deep learning algorithms to enable smart and agile binning of defect types. The ICOS T3 and T7 inspectors share a common platform, enabling reconfiguration from tray to tape output for optimal tool use in a changing environment.

Applications

Component Outgoing Quality Control (OQC) for all package types (Thin Quad Flat Package (TQFP), Quad Flat Package (QFP), BGA, Chip Scale Package (CSP), Wafer-Level Package (WLP), QFN, Bump Chip Carrier (BCC), Land Grid Array (LGA), and more…)

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ICOS T890

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ICOS T890

Packaged IC Inspection and Metrology Systems

The ICOS T890 component inspector provides high-performance, fully automated optical inspection of packaged integrated circuit (IC) components. It leverages high sensitivity with 2D and 3D measurements to determine final package quality for a wide range of device types and sizes. The ICOS T890 offers parallel operation of four independent inspection stations and a component sorting station, achieving high throughput, cost-effective component inspection.

Applications

Component Outgoing Quality Control (OQC) for all package types (Thin Quad Flat Package (TQFP), Quad Flat Package (QFP), BGA, Chip Scale Package (CSP), Wafer-Level Package (WLP), QFN, Bump Chip Carrier (BCC), Land Grid Array (LGA), and more…)

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Klarity®

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Klarity®

Automated Defect and Yield Data Analysis

Klarity® Defect automated defect analysis and data management system helps fabs achieve faster yield learning cycles through real-time excursion identification. Klarity® SSA (Spatial Signature Analysis) analysis module for Klarity Defect provides automatic detection and classification of defect signatures that indicate process issues. Klarity® ACE XP advanced yield analysis system helps fabs capture, retain and share yield learning within and across fabs for yield acceleration. Klarity systems utilize an intuitive decision flow analysis, allowing engineers to easily create customized analyses that support applications such as lot dispositioning, review sampling, defect source analysis, SPC setup and management, and excursion notifications. Klarity Defect, Klarity SSA and Klarity ACE XP form a fab-wide yield solution that automatically reduces defect inspection, classification and review data to relevant root-cause and yield-analysis information. Klarity data helps IC, packaging, compound semi and HDD manufacturers take corrective action sooner, resulting in accelerated yield and better time to market.

Applications

Defect data analysis, Wafer disposition, Process and tool excursion identification, Spatial signature analysis, Yield analysis, Yield prediction

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