Direct Imaging for Solder Mask
KLA's direct imaging (DI) solutions for solder mask (SM) deliver high-accuracy, high-quality imaging with production throughput for any solder mask design, from the simplest to the most complex. These high-capacity, field-proven solutions for mass production ensure consistently precise imaging quality with a low total cost of ownership for a wide variety of applications including high-density interconnects (HDI), multi-layer boards (MLB), and flexible printed circuit boards (FPCB), as well as specialized white solder mask applications like miniLED backlight unit-based products, either on PCB or glass substrates.
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Orbotech Diamond™ 10
Direct Imaging for Solder Mask Exposure
The Orbotech Diamond™ 10 advanced high-capacity direct imaging (DI) system is designed for a wide variety of solder mask (SM) applications. Powered by KLA’s proprietary SolderFast™ technology, the field-proven Orbotech Diamond 10 system delivers high-quality imaging and high throughput for the most complex designs, including high-density interconnect (HDI), multi-layer boards (MLB) and flexible printed circuit boards (FPCB). It raises the DI bar for solder mask applications as a high-end mass production solution that enhances imaging accuracy while decreasing total cost of ownership (TCO).
High-density interconnect (HDI), Multi-layer boards (MLB), Flexible printed circuit boards (FPCB)
Orbotech Diamond 10T/10TXL
Advanced high-capacity direct imaging system designed to meet the unique demands and challenges of thick solder mask applications.
Orbotech Diamond™ 10W
Direct Imaging for White Solder Mask Exposure
The Orbotech Diamond™ 10W advanced high-capacity direct imaging (DI) system is designed for the unique challenges of white solder mask PCB applications, such as the production of miniLED backlight units. The field-proven Orbotech Diamond 10W is a dedicated system for white solder mask that delivers high-quality imaging and high throughput for the mass production of the most complex white solder mask designs. Powered by KLA’s proprietary SolderFast™ technology, the Orbotech Diamond 10W system raises the DI bar for white solder mask applications, enhancing imaging accuracy and quality, while decreasing total cost of ownership (TCO).
MiniLED backlight units produced with white solder mask for TVs, monitors, PCs, tablets, wearables, automotive and more
Orbotech Diamond 10M/10MXL
Advanced high-capacity direct imaging system designed for both white and non-white solder resists for a variety of PCB applications.
Orbotech Diamond GWXL
Advanced high-capacity direct imaging system designed for the unique challenges of white solder mask applications on glass substrate, for miniLED backlight unit applications such as TVs, monitors and more.
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