Cu interconnects, Damascene processes, Plating
Chemistry Process Control
KLA’s chemistry process control products support multiple applications for chip manufacturing, including analysis and monitoring of critical damascene, clean and wet etch processes. Chemistry analysis systems help engineers qualify processes during development, and seamlessly integrate with process tools for online monitoring during high volume production. The information produced by our chemistry process control systems allows chip manufacturers to quickly optimize processes and achieve higher yield and reliability.
Quali-Line® Prima®
Online Chemical Management System for Copper Damascene
The Quali-Line® Prima® 2 system analyzes and controls copper damascene processes for plating advanced nodes. Developed for advanced chip, solar and hard disk drive manufacturing at high-volume, the chemical monitoring system for Cu interconnects supports conventional, ultra-low and high Cu concentration chemistries and facilitates accurate Cu plating for semiconductor devices. The Quali-Line Prima 2 system is easily combined with advanced plating tools and provides fast analysis and precise control to discover inorganic and organic components with optimal accuracy and repeatability.
Quali-Line® Prima
Online chemical management of Cu damascene process
Quali-Line Quanta®
Online Chemical Management System for Cobalt Deposition
The Quali-Line Quanta® system analyzes cobalt plating in BEOL/MOL processes for advanced node logic and memory devices by measuring concentrations of inorganic and organic components with optimal precision and accuracy. Developed for high-volume manufacturing, the Quali-Line Quanta system supports conventional Co chemistries and facilitates accurate Co metallization for advanced interconnect processes. It features fully automatic validation and calibration, intelligent self-diagnostics and seamless integration with cobalt plating tools.
Advanced Co interconnect processes, Cyclic Voltammetric Stripping (CVS), Spectroscopy, Potentiometric titration
QualiSurf®
Online Chemical Monitoring System for Wet Etch/Clean Applications
The QualiSurf® chemical monitoring system supports advanced cleaning and wet etching applications in semiconductor FEOL, MOL and BEOL processes to minimize waste from non-optimal chemistry. Formulated for both chemical components, and etched products or process contaminants (for reclaimed chemicals), it provides powerful insights based on more than 15 integrated analytical methods, including spectral, electrochemical and titration methods. The QualiSurf online metrology system precisely monitors and controls each chip manufacturing process and chemistry with high accuracy and repeatability, ensured by auto calibration, validation and a self-analyzer health check.
SiGe etch, Nitride etch, Poly Si etch, W, Cu, or Co post etch residue removal (PERR), Hard mask (HM) removal, Etch stop layer (ESL) removal, Hard mask opening (HMO) processes, Photoresist (PR) removal or rework, Self-assembled monolayer (SAM), Mo/Ru etch
QualiSurf® 500 Series
Online metrology for the FEOL selective silicon nitride (Si3N4) etch process, seamlessly interfacing with a single wafer or batch process tool for fast analysis and reuse of chemicals.
QualiSurf® 900 Series
Online metrology for FEOL selective silicon (Si) etch chemistries with sophisticated dissolved oxygen (DO) analysis at the ppm/ppb level of accuracy.
QualiSurf® 200/700/800 Series
Online metrology for MOL/BEOL (BEOL PERR, HM and ESL removal) formulated chemistries to utilize reclaimed chemicals without safety or process quality issues. Supports SAM and other surface modification chemistries.
QualiSurf® 600 Series
Online metrology to accurately measure components in W etch chemistries for MOL/BEOL with fast and accurate monitoring, even in the presence of H2O2.
The QualiLab Elite® benchtop lab instruments support chemistry analysis for evolving industry technologies and university applications.
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