Certified & Remanufactured
Substrate Manufacturing
Surfscan® Series
Unpatterned Wafer Defect Inspection Systems
The Surfscan® unpatterned wafer inspection systems identify defects and surface quality issues that affect the performance and reliability of semiconductor devices. It supports IC, OEM, materials and substrate manufacturing by qualifying and monitoring tools, processes and materials, by quickly isolating surface defects.
Applications
Process qualification, Tool qualification, Tool monitoring, Outgoing wafer quality control, Incoming wafer quality control, Resist and scanner qualification, Process debug.
Related Products
Surfscan SP2XP:
Unpatterned wafer inspection system targeted for technologies ≥ 45nm design node.
Download brochure.Surfscan SP2:
Unpatterned wafer inspection system targeted for technologies ≥ 65nm design node.
Download brochure.Surfscan SP1DLS Pro:
Unpatterned wafer inspection system targeted for technologies ≥ 90nm design node.
Download brochure.Surfscan SP1TBI Pro:
Unpatterned wafer inspection system targeted for technologies ≥ 130nm design node.
Download brochure.eDR™-5210
e-Beam Wafer Defect Review and Classification System
The eDR™-5210 electron-beam (e-beam) wafer defect review and wafer classification system captures high resolution images of defects, producing an accurate representation of the defect population on a wafer. The eDR provides unique linkage to KLA inspectors for faster yield learning during IC and wafer manufacturing.
Applications
Defect imaging, Automatic inline defect classification and performance management, Bare wafer outgoing and incoming quality control, Wafer dispositioning, Hotspot discovery, Defect discovery, Process window discovery, Process window qualification, Bevel edge review.
eDR® is a registered trademark of KLA Corporation.
MicroSense® C200L & C200M
200mm Silicon Wafer Geometry System
The MicroSense® C200L, formerly known as the UltraMap UMA-C200L, and the C200M are industry standard, bare wafer geometry measurement systems used by wafer manufacturers to qualify polished and epitaxial 200mm silicon wafers. Patented dual probe, non-contact capacitance sensors with nanometer resolution offer precise and accurate automated geometry measurements at high throughout. Direct, material-independent, high resolution, high-density measurements (>200,000 data points/200mm wafer) are captured on each wafer to generate 2D and 3D wafer maps. System output metrics include thickness, Total Thickness Variation, bow/warp, wafer P/N type & resistivity as well as flatness measurements for whole wafer, sites, and edge sites. Predefined quality criteria and five cassette hardware configuration allows for flexible wafer sorting options.
Click here to download the MicroSense® C200L & C200M brochure.
Applications
Wafer process monitoring and control, Outgoing wafer quality control (OQC), Incoming quality control wafer fab (IQC).
Related Products
MicroSense CSW1:
150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes.
Download brochure.MicroSense STR1:
150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes includes 2D stress option.
Download brochure.MicroSense BP1:
150/200mm bridge tool for thinned back grind wafers, sawn or polished, for Si, SiC, GaN, GaAs, sapphire.
Download brochure.MicroSense® CSW1
150mm/200mm Wafer Geometry System
The MicroSense® CSW1, formerly known as the UltraMap UMA-C200, is a bare wafer geometry measurement system used by wafer manufacturers to qualify sawn, polished and epitaxial 150mm and 200mm silicon and SiC substrates and others including GaN, GaAs, sapphire and epitaxy processes. As a bridge tool with two cassettes, the CSW1 can simultaneously accommodate both 150 and 200mm wafers. Patented dual probe, non-contact capacitance sensors with nanometer resolution offer precise and accurate automated geometry measurements at high throughout. System output includes high density 2D and 3D maps of thickness, flatness, shape, site flatness and edge metrics.
Click here to download the MicroSense® CSW1 brochure.
Applications
Wafer process monitoring and control, Outgoing wafer quality control (OQC)
Related Products
MicroSense C200L/M:
200mm wafer measurement tool for polished silicon and epitaxial wafer manufacturers.
Download brochure.MicroSense STR1:
150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes includes 2D stress option.
Download brochure.MicroSense BP1:
150/200mm bridge tool for thinned back grind wafers, sawn or polished, for Si, SiC, GaN, GaAs, sapphire.
Download brochure.MicroSense® BP1
150mm and 200mm Wafer Geometry System
The MicroSense® BP1, formerly known as the UltraMap UMA-200-BP, is a bare wafer geometry measurement system used by wafer manufacturers to qualify sawn, polished and epitaxial silicon and SiC substrates and others including GaN, GaAs, sapphire and epitaxy processes. Wafers and substrates can be round or square and measure up to 200mm in extent. A variety of wafer holders are available. The BP1 precisely measures wafer thickness, flatness and shape using two patented, non-contact, high resolution, auto-positioning back pressure probes. The BP1 is an extremely flexible system that can measure a wide range of wafer thicknesses and any wafer material. Wafer surface finish has no effect on the measurement - the tool measures sawn, lapped or polished wafers.
Click here to download the MicroSense® BP1 brochure.
Applications
Wafer process monitoring and control, Outgoing wafer quality control (OQC)
Related Products
MicroSense C200L/M:
200mm wafer measurement tool for polished silicon and epitaxial wafer manufacturers.
Download brochure.MicroSense STR1:
150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes includes 2D stress option.
Download brochure.MicroSense CSW1:
150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes.
Download brochure.Certified & Remanufactured