Certified & Remanufactured
Metrology
ASET-F5x Pro
Film Metrology System
The ASET-F5x Pro film metrology system provides reliable, affordable and high precision thin film measurements of film thickness, refractive index, and bow/stress capability across a broad range of film stacks and geometries. The system features capabilities that provide absolute accuracy, reproducibility and system-to-system matching required for fabs that manufacture devices for the IoT, automotive and mobile markets. The ASET-F5x Pro integrates precise optical spectroscopic ellipsometry and reflectometry metrology technologies in a single system to manage the full range of thin film measurement challenges required by µLED, MEMs and IC manufactures.
Applications
On-product film thickness and stoichiometry control, Inline tool and process monitoring for lithography, deposition, CMP and etch, Process tool matching.
Archer™
Overlay Metrology Systems
The Archer™ imaging-based overlay metrology system provides robust, accurate, reliable, and reproducible overlay registration and CD measurements on various substrate types, sizes, materials and thicknesses. The industry proven Archer platform provides fast, repeatable and the system-to-system matched performance required by fabs producing products for the IoT, automotive, µLED and mobile segments.
MicroSense® STR1
150 and 200mm Silicon Wafer Geometry System
The MicroSense® STR1 of the UltraMap family, is a wafer geometry measurement system used by front end semiconductor manufacturers to qualify incoming polished and epitaxial 150/200mm silicon, SiC and other substrates including GaN, GaAs, sapphire and epitaxy processes as well as front-end, unpatterned deposition processes.
Patented dual probe, non-contact capacitance sensors with nanometer resolution offer precise and accurate automated geometry measurements at high throughout. Full wafer mapping with 120,000 measurements per wafer output included high density 2D and 3D maps of thickness, flatness, shape, 2D stress, Total Thickness Variation, bow, warp, site and edge metrics.
Click here to download the MicroSense® STR1 brochure.
Applications
Wafer process monitoring and control, Incoming quality control wafer fab (IQC), Front-end chip mfg., 2D stress control and monitoring.
Related Products
MicroSense CSW1:
150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes.
Download brochure.MicroSense BP1:
150/200mm bridge tool for thinned back grind wafers, sawn or polished, for Si, SiC, GaN, GaAs, sapphire.
Download brochure.MicroSense C200L/M:
200mm wafer measurement tool for polished silicon and epitaxial wafer manufacturers.
Download brochure.Certified & Remanufactured