Certified & Remanufactured


ASET-F5x Pro

Film Metrology System

The ASET-F5x Pro film metrology system provides reliable, affordable and high precision thin film measurements of film thickness, refractive index, and bow/stress capability across a broad range of film stacks and geometries. The system features capabilities that provide absolute accuracy, reproducibility and system-to-system matching required for fabs that manufacture devices for the IoT, automotive and mobile markets. The ASET-F5x Pro integrates precise optical spectroscopic ellipsometry and reflectometry metrology technologies in a single system to manage the full range of thin film measurement challenges required by µLED, MEMs and IC manufactures.

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On-product film thickness and stoichiometry control, Inline tool and process monitoring for lithography, deposition, CMP and etch, Process tool matching.


Overlay Metrology Systems

The Archer imaging-based overlay metrology system provides robust, accurate, reliable, and reproducible overlay registration and CD measurements on various substrate types, sizes, materials and thicknesses. The industry proven Archer platform provides fast, repeatable and the system-to-system matched performance required by fabs producing products for the IoT, automotive, µLED and mobile segments.

Related Products
Feature Archer 10XT+/AIM+ Archer 200 Archer 300
300mm Wafer Yes Yes Yes
200mm Wafer Yes Yes Yes
150mm water Yes No No
AIM® 24×24 Yes Yes Yes
AIM® 15×15 No Yes Yes
µAIM 10×10 No Yes Yes
AIMid 5×5 No No Yes
5D Analyzer® Yes Yes Yes
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MicroSense® STR1

150 and 200mm Silicon Wafer Geometry System

The MicroSense® STR1 of the UltraMap family, is a wafer geometry measurement system used by front end semiconductor manufacturers to qualify incoming polished and epitaxial 150/200mm silicon, SiC and other substrates including GaN, GaAs, sapphire and epitaxy processes as well as front-end, unpatterned deposition processes.

Patented dual probe, non-contact capacitance sensors with nanometer resolution offer precise and accurate automated geometry measurements at high throughout. Full wafer mapping with 120,000 measurements per wafer output included high density 2D and 3D maps of thickness, flatness, shape, 2D stress, Total Thickness Variation, bow, warp, site and edge metrics.

Click here to download the MicroSense® STR1 brochure.


Wafer process monitoring and control, Incoming quality control wafer fab (IQC), Front-end chip mfg., 2D stress control and monitoring.

Related Products

MicroSense CSW1:

150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes.

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MicroSense BP1:

150/200mm bridge tool for thinned back grind wafers, sawn or polished, for Si, SiC, GaN, GaAs, sapphire.

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MicroSense C200L/M:

200mm wafer measurement tool for polished silicon and epitaxial wafer manufacturers.

Download brochure.

Certified & Remanufactured

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