Certified & Remanufactured

Defect Inspection

Surfscan® Series

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Surfscan® Series

Unpatterned Wafer Defect Inspection Systems

The Surfscan® unpatterned wafer inspection systems identify defects and surface quality issues that affect the performance and reliability of semiconductor devices. It supports IC, OEM, materials and substrate manufacturing by qualifying and monitoring tools, processes and materials, by quickly isolating surface defects.

Applications

Process qualification, Tool qualification, Tool monitoring, Outgoing wafer quality control, Incoming wafer quality control, Resist and scanner qualification, Process debug.

Related Products

Surfscan SP2XP:

Unpatterned wafer inspection system targeted for technologies ≥ 45nm design node.

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Surfscan SP2:

Unpatterned wafer inspection system targeted for technologies ≥ 65nm design node.

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Surfscan SP1DLS Pro:

Unpatterned wafer inspection system targeted for technologies ≥ 90nm design node.

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Surfscan SP1TBI Pro:

Unpatterned wafer inspection system targeted for technologies ≥ 130nm design node.

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2835, 2367

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2835, 2367

Broadband Plasma Patterned Wafer Defect Inspection Systems

The 2835 and 2367 broadband plasma defect inspection systems provide industry proven performance for optical patterned defect inspection, enabling discovery and monitoring of yield-critical defects on ≥ 45nm logic, memory and specialty devices. Each model is uniquely equipped with selectable wavelength illumination, imaging pixels, optic modes and advanced algorithms for noise suppression and defect separation to provide cost-effective, inline inspection control for your most critical levels.

Applications

Inline defect discovery and monitoring, Hotspot discovery, Engineering analysis, Process window qual, Photo cell monitoring.

Related Products

2835:

Patterned wafer inspection system with broadband DUV-UV-Visible spectrum targeted for ≥45nm design nodes.

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2367:

Patterned wafer inspection system with broadband UV-Visible spectrum targeted for ≥65nm design nodes.

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Puma 91xx

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Puma 91xx

Laser Scanning Patterned Wafer Defect Inspection Systems

The Puma 9130 and 9150 laser imaging inspectors combine UV illumination optics with multiple high speed imaging sensors to offer a range of optical modes for critical defect detection inline on patterned, production wafers. The 91xx delivers high sampling rates, high throughput and high sensitivity enabling more effective capture and control of yield-impacting defects on critical Front end-of-line (FEOL) and Back-end-of-line (BEOL) layers. The 91xx complements the KLA 2367 full-spectrum UV/visible and 2835 DUV/UV/visible brightfield inspectors for a complete mix and match patterned wafer inspection strategy.

Applications

Line monitor, Tool monitor, Tool qualification, Film defectivity, Photo cell monitoring, ADI.

Related Products

Puma 9150:

Patterned wafer inspection with UV illumination laser-based imaging technology. The 9150 extends the 9130 with the addition of normal illumination, enhanced data rates and new optical modes for improved capability.

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Puma 9130:

Patterned wafer inspection with UV illumination laser-based imaging technology.

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eDR-5210

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eDR-5210

e-Beam Wafer Defect Review and Classification System

The eDR-5210 electron-beam (e-beam) wafer defect review and wafer classification system captures high resolution images of defects, producing an accurate representation of the defect population on a wafer. The eDR provides unique linkage to KLA inspectors for faster yield learning during IC and wafer manufacturing.

Applications

Defect imaging, Automatic inline defect classification and performance management, Bare wafer outgoing and incoming quality control, Wafer dispositioning, Hotspot discovery, Defect discovery, Process window discovery, Process window qualification, Bevel edge review.

eDR® is a registered trademark of KLA Corporation.

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