We are proud to be a Gold sponsor of the 3D & Systems Summit 2025. KLA’s Dave Thomas will be presenting “Implications on Wafer Processing of the move from Pluggable to Co-Packaged Optics” in Session 5 on Friday, June 27, 8:40 am – 9:20 am.

Themed “Heterogeneous Integration: Bolstering Europe’s Resilience”, the 3D & Systems Summit 2025 will primarily focus on exploring strategies for enhancing Europe’s semiconductor industry addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques.”