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Kicking Off a Week of Engagement with the Annual KLA Interconnect Event

Feb 28, 2024 1 min read

KLA launched into the 2024 SPIE Advanced Lithography + Patterning conference for emerging semiconductor technology with the annual KLA Interconnect forum, hosting customers and industry experts for a night of networking and setting the tone for four days of engagement on critical industry challenges and opportunities.

In addition to connecting to colleagues, this week’s SPIE event is an opportunity for participants to discuss the latest technology breakthroughs and attend conferences focusing on the advancement of the semiconductor industry.

Keep an eye on Advance for more on the SPIE Advanced Lithography + Patterning conference and some thoughts from KLA leaders about the semiconductor industry’s road ahead.

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