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The International Conference of Wafer Bonding

imec and KLA are co-authors of the presentation “Wafer-to-Wafer Process Characterization and Monitoring using PWG Fizeau Interferometer” at WaferBond ’19, The International Conference of Wafer Bonding.

WaferBond covers all aspects of bonding wafers, from basic research to industrial applications. The conference will also address quality and reliability issues.

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