SPIE Photomask Technology + EUV Lithography 2018 Exhibition is the premier worldwide technical meeting for mask making, emerging mask technologies, and the future of the mask business. imec and KLA-Tencor are co-authors of the presentation “EUV stochastic defect monitoring with advanced broadband optical wafer inspection and e-beam review systems” in the EUV Conference Session 3: EUV Process Control. SK Hynix and KLA-Tencor are co-authors of the presentation “Non-Gaussian CD distribution characterization for DRAM application in EUV lithography” in the EUV Conference Session 3: EUV Process Control. Micron and KLA-Tencor are co-authors of the poster “Validation of EUV mask defect disposition using SEM-2-Aerial” in the EUV Conference Poster Session PS1: EUV Mask. Fractilia and KLA-Tencor are co-authors of the poster “Study of roughness components in the frequency domain via experimental and simulated images” in the EUV Conference Poster Session PS5: Process Control. KLA-Tencor will present “Fast local registration measurements for efficient e-beam writer qualification and correction (Best EMLC Paper)” in the Photomask Technology Conference Session 3: Mask Inspection, Metrology, and Repair. These two conferences are being held in one location: Monterey Conference Center and Monterey Marriott, Monterey, CA.