KLA’s Stephen Hiebert will present “Inspection and Metrology Challenges for 3DIC Interconnect Scaling” in the memory session. For the 5th year, NCAP and Yole Développement will combine their expertise to build an innovative program dedicated to the advanced packaging industry. The program was created to understand the status of the advanced packaging industry and help the companies to be part of the ‘tomorrow’ industry. The Advanced Packaging & System Integration Technology Symposium is unique. Don’t miss it!