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International Conference on Planarization/CMP Technology (ICPT)

ICPT is an annual conference covering all aspects of chemical-mechanical polishing. The conference will provide an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research in CMP technology. KLA-Tencor’s Andrew Cross will present a coauthored paper with imec, “On-Product Metrology at High Resolution Over Full Wafer — Applications for CMP & Fin Process Development” during the conference.

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