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KLA-Tencor will be exhibiting at SEMICON Taiwan and is proud to be a sponsor. SEMICON Taiwan is the premier event in Taiwan for microelectronics manufacturing. This event connects companies, people, products and information that shape the future of design and manufacturing for semiconductors, nanoelectronics, MEMS, photovoltaics and related advanced electronics. KLA-Tencor authors will present at four forums. Oreste Donzella will present "Addressing Process Control Challenges for 5nm EUV Lithography" at the IC Forum, while Stephen Hiebert will talk about “Defect Inspection for High-Density Fan-Out SiP Applications” at the SiP Global Summit. Akash Nanda discusses “Defect Inspection and Metrology for III-V Compound Semiconductor Wafers” in the Power and Compound Semiconductor Forum, and Jeroen Hoet will present “Innovative Technique for Advanced Fan-In Wafer Level Package Process Control” in the Advanced Packaging Technology Symposium.

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