Advanced Packaging Webinar Series (Part III) – PVD Processes for UBM/RDL

Nov 10, 2021

In the third and final part of our webinar series on the various wafer level processes that are enabling the implementation of a range of different “advanced” packaging solutions, this 35-40 min presentation will describe recent developments in this market and focus on the challenges and solutions for metal deposition using physical vapor deposition (PVD) in specific applications.

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