Advanced Packaging Webinar Series (Part II) – Plasma Etch Solutions for Advanced Packaging

Sep 22, 2021

This webinar will give an introduction to the various plasma etch solutions provided by KLA for applications within the Advanced Packaging space. From etching and revealing TSVs for 3D stacking, through to adapting the dry etch as a replacement for CMP, these techniques and solutions will be described and discussed.

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