Dr. Marco Sebastiani: The pillar splitting method for fracture toughness measurement at the micron scale

Jun 29, 2020

The analysis of deformation and failure mechanisms in small-scale devices and thin films is a critical issue, not yet solved. In this presentation, we describe recent advances and developments for the measurement of fracture toughness at small scales by the use of nanoindentation-based methods, including beam-bending methods and micro-pillar splitting. A critical comparison of the techniques is made, by testing a selected group of bulk and thin film materials. Additionally, the extension of the pillar splitting method to the use with different sharp indenters (from Berkovich to cube-corner) and its use for high-temperature and controlled environments testing are discussed. Finally, a couple of relevant case studies are presented, including Li-ion battery composites and thermal barrier coatings, in order to demonstrate that fast and reliable industrial application for such methods is possible.

Are you sure?

You've selected to view this site translated by Google Translate.
KLA China has the same content with improved translations.

Would you like to visit KLA China instead?



If you are a current KLA Employee, please apply through the KLA Intranet on My Access.