Surfscan^®

Surfscan^®

Unpatterned Wafer Defect Inspection Systems

The Surfscan^® SP7^XP unpatterned wafer inspection system identifies defects and surface quality issues that affect the performance and reliability of leading-edge logic and memory devices. It supports IC, OEM, materials and substrate manufacturing by qualifying and monitoring tools, processes and materials, including those used for EUV lithography. Using a DUV laser and optimized inspection modes, the Surfscan SP7^XP delivers ultimate sensitivity for advanced node R&D and the throughput to support high volume manufacturing. Complementary detection modes, including the phase contrast channel (PCC) and normal illumination (NI), detect unique defect types for bare wafers, smooth and rough films, and fragile resists and litho stacks. Image based defect classification (IBC) using revolutionary machine learning algorithms support faster time to root cause, while the Z7^™ classification engine supports unique 3D NAND and thick film applications.

Click here to download the Surfscan SP7^XP brochure.

Surfscan^® SP Ax

Surfscan^® SP Ax

Unpatterned Wafer Defect Inspection System

The Surfscan^® SP A2 and Surfscan^® SP A3 unpatterned wafer inspection systems identify defects and wafer surface quality issues that affect the performance and reliability of chips manufactured for the automotive, IoT, 5G, consumer electronics, and industrial (military, aerospace, medical) applications. These inspection systems support IC, OEM, materials and substrate manufacturing by qualifying and monitoring tools, processes and materials. Using a DUV laser and optimized inspection modes, the Surfscan SP Ax systems deliver the sensitivity required to support fabs defect reduction strategies. Standard darkfield and optional brightfield inspection modes run concurrently, enabling capture and classification of yield critical and latent reliability defect types. Built on the industry-leading Surfscan platform, the Surfscan SP A2/A3 inspectors support 150mm, 200mm and 300mm wafers, and are configurable and flexible to meet the cost and performance targets for a range of applications.

Click here to download the Surfscan SP3/Ax brochure.

eDR7xxx^™

eDR7xxx^™

e-Beam Wafer Defect Review and Classification Systems

The eDR7380™ electron-beam (e-beam) wafer defect review and wafer classification system captures high resolution images of defects, producing an accurate representation of the defect population on a wafer. With a wide range of electron optics and a dedicated In-Lens Detector, the eDR7380 supports defect visualization across process steps, including fragile EUV lithography layers, high aspect ratio trench layers and voltage contrast layers. Unique Simul-6™ technology produces a complete DOI pareto in one test for accurate defect sourcing and faster excursion detection. With connectivity features, such as IAS™ for broadband optical patterned wafer inspectors and OptiSens™ for bare wafer inspectors, the eDR7380 provides unique linkage to KLA inspectors for faster yield learning during IC and wafer manufacturing.

WaferSight™

WaferSight™

Bare Wafer Geometry Metrology Systems

The WaferSight™ 2+ bare wafer geometry metrology system qualifies polished and epitaxial silicon wafers, and engineered and other advanced substrates for wafer manufacturers. By producing wafer flatness, dual-sided nanotopography and high-resolution edge roll-off data, the WaferSight 2+ produces the data that helps wafer manufacturers ensure that first quality substrates are being produced in volume production.

FabVision^®2

FabVision^®2

Data Management for Wafer Fabrication

FabVision^®2 is an automated, high-availability hardware and data management software solution for wafer and substrate manufacturers. FabVision2 continuously monitors and manages product quality, inspection, and metrology information to provide real-time wafer fabrication process excursion alerts and distribute data reports automatically to better manage worldwide operations. The integrated database and intuitive client software enable quick analysis and response to inquiries about product history and quality. FabVision2 advanced inspection and metrology packages assist with data analysis and data reprocessing to produce critical, real-time information needed by management, engineering, and operations to optimize the wafer fabrication process and maximize product yield. FabVision2XP offers an extended hardware server and storage option.

Candela^® 8xxx

VCSEL array image courtesy of Philips Photonics

Candela^® 8xxx

Advanced Surface Inspection for Compound Semiconductor Materials

The Candela^® 8720 compound semiconductor material surface inspection system enables GaN-related materials, GaAs substrate and epi process control with high sensitivity to critical defects for production of power devices, communications and RF devices, and advanced LEDs (as well as upcoming microLEDs). With its proprietary optical design and detection technology, the Candela 8720 detects and classifies sub-micron defects that are not consistently identified by current inspection methods, supporting production-line monitoring for yield-limiting defects.

Candela^® 8520

Candela^® 8520

Defect Inspection Solution for SiC and GaN Substrates

The Candela^® 8520 defect inspection system is designed for advanced characterization of SiC and GaN substrates, often used for power devices in automotive and other applications. Integrated surface scattering and photoluminescence inspection technologies capture a wide variety of mission-critical topographic and crystallographic defects, like triangles, carrots, stacking faults and basal plane dislocations. The Candela 8520 system helps substrate manufacturers improve quality and yield, and optimize their epitaxial growth processes. Better substrates can improve power device yield and reliability. Read more about the Candela 8520 here.

Candela^® 71xx

Candela^® 71xx

Hard Disk Drive Media and Substrates Defect Inspection and Classification Systems

The Candela^® 71xx Series advanced media and substrate defect detection and classification system for hard disk drive manufacturing helps maximize yield and lower hard disk inspection cost. A dual optical path configuration enables classification of unique defect signatures for critical submicron defects, such as micro-pits, bumps, particles and buried defects. The Candela 7110 configuration supports manual loading of substrates for inspection, while the Candela 7140 provides fully automated cassette-to-cassette substrate loading.

A high sensitivity (HS) option provides enhanced sensitivity and capture rate for both bare glass and metal substrate inspection.

Candela^® 63xx

Candela^® 63xx

Hard Disk Drive Media and Substrates Topography Measurement and Defect Inspection System

The Candela^® 63xx dual laser-based inspection system provides surface inspection of hard disk drive substrates and finished media. Its unique multi-channel optical design enables roughness and waviness metrology measurements on both smooth metal and glass substrates. Defects, such as particles and scratches, can be automatically detected and classified using the same platform. The Candela 6310 is a manual system suited for both laboratory and low volume production, while the Candela 6340 is a fully automated cassette-to-cassette system for production environments.

MicroSense^® C200L & C200M

MicroSense^® C200L & C200M

200mm Silicon Wafer Geometry System

The MicroSense^® C200L, formerly known as the UltraMap UMA-C200L, and the C200M are industry standard, bare wafer geometry measurement systems used by wafer manufacturers to qualify polished and epitaxial 200mm silicon wafers. Patented dual probe, non-contact capacitance sensors with nanometer resolution offer precise and accurate automated geometry measurements at high throughout. Direct, material-independent, high resolution, high-density measurements (>200,000 data points/200mm wafer) are captured on each wafer to generate 2D and 3D wafer maps. System output metrics include thickness, Total Thickness Variation, bow/warp, wafer P/N type & resistivity as well as flatness measurements for whole wafer, sites, and edge sites. Predefined quality criteria and five cassette hardware configuration allows for flexible wafer sorting options.

Click here to download the MicroSense^® C200L & C200M brochure.

MicroSense^® CSW1

MicroSense^® CSW1

150mm/200mm Wafer Geometry System

The MicroSense^® CSW1, formerly known as the UltraMap UMA-C200, is a bare wafer geometry measurement system used by wafer manufacturers to qualify sawn, polished and epitaxial 150mm and 200mm silicon and SiC substrates and others including GaN, GaAs, sapphire and epitaxy processes. As a bridge tool with two cassettes, the CSW1 can simultaneously accommodate both 150 and 200mm wafers. Patented dual probe, non-contact capacitance sensors with nanometer resolution offer precise and accurate automated geometry measurements at high throughout. System output includes high density 2D and 3D maps of thickness, flatness, shape, site flatness and edge metrics.

Click here to download the MicroSense^® CSW1 brochure.

MicroSense^® BP1

MicroSense^® BP1

150mm and 200mm Wafer Geometry System

The MicroSense^® BP1, formerly known as the UltraMap UMA-200-BP, is a bare wafer geometry measurement system used by wafer manufacturers to qualify sawn, polished and epitaxial silicon and SiC substrates and others including GaN, GaAs, sapphire and epitaxy processes. Wafers and substrates can be round or square and measure up to 200mm in extent. A variety of wafer holders are available. The BP1 precisely measures wafer thickness, flatness and shape using two patented, non-contact, high resolution, auto-positioning back pressure probes. The BP1 is an extremely flexible system that can measure a wide range of wafer thicknesses and any wafer material. Wafer surface finish has no effect on the measurement - the tool measures sawn, lapped or polished wafers.

Click here to download the MicroSense^® BP1 brochure.