SiC Substrate & Epitaxy Inspection Solution

Power Device Inspection Portfolio

Candela CS920 Product Image

High sensitivity to CMP scratches and micropipes on SiC substrates

Unique signature from high resolution imaging, enabling convenient defect review.

CMP scratches on SiC substrates

Close up of CMP scratches on SiC substrates
Close up of stress region and micropipes on SiC substrates

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High sensitivity to CMP scratches and micropipes on SiC substrates

Unique signature from high resolution imaging, enabling convenient defect review.

CMP scratches on SiC substrates

Close up of CMP scratches on SiC substrates
Close up of stress region and micropipes on SiC substrates

Integrated surface and photoluminescence channels for SiC epitaxy defect detection

image of surface triangle on SiC epitaxy layer

Surface triangles are device killers

image of step bunching on SiC substrate

Step bunching are potential yield killers

image of SiC epitaxy layer with stacking faults

Stacking faults detected by photo–luminescence channel

image of basal plane dislocations (BPD) surface defect

BPD detection & imaging

Compound Semi

Compound Semi | MEMS | HDD Manufacturing

Compound Semi

KLA has a comprehensive portfolio of inspection, metrology, and data analytics systems to support power devices, RF communications, LED, photonics, MEMS, CPV solar and display manufacturing.

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