Automated Metrology
Automated Metrology
KLA Instruments™ automated metrology systems enable fab process control to quantify material deposited/removed, surface topography/roughness, critical dimensions and automated optical inspection (AOI). Applications include step height, film thickness and defect inspection/review. These KLA Instruments metrology tools provide automation for production environments and include the HRP®-260 and Tencor® P-170 stylus profilers, the Zeta™-388 optical profiler and the Filmetrics® F60-c film thickness mapper.
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View AllZeta™-388 Optical Profiler
The Zeta-388 3D surface topography measurement system combines the Zeta-300 non-contact 3D optical profiler system with a cassette-to-cassette wafer handler, pattern recognition, automated data analysis and SECS/GEM to support production measurement requirements.
Tencor® P-170 Stylus Profiler
The Tencor P-170 stylus profilometer enables fully automated measurements for the compound semiconductor industry, supporting cassette-to-cassette wafer handling including silicon, sapphire, silicon carbide, gallium arsenide, glass and more.
HRP®-260 Stylus Profiler
Built for high throughput and the reliability required in a production environment, the HRP-260 stylus profilometer combines high resolution, long scan capability and cassette-to-cassette wafer handling.
Filmetrics® F60-c Automated Film Thickness Mapper
The F60-c is a fully automated cassette-to-cassette metrology system for measuring film thickness on unpatterned production or monitor wafers. Seven configurations cover film thickness from 5nm up to 3mm.
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