8 Series

8 Series

High Productivity Patterned Wafer Broad Range Inspection Systems

The 8 Series patterned wafer inspection systems detect a wide variety of defect types at very high throughput for fast identification and resolution of production process issues. The 8 Series provides cost-effective defect monitoring for 150mm, 200mm or 300mm silicon and non-silicon substrates from initial product development through volume production. The latest generation 8935 inspector employs new optical technologies and DesignWise^® and FlexPoint^™ precise area inspection techniques to capture critical defects that can cause chip failures. DefectWise^® AI technology enables fast, inline separation of defect types for improved defect discovery and binning. With these innovations, the 8935 supports high productivity capture of yield and reliability-related defects at a low nuisance rate, helping both leading-edge and legacy node fabs accelerate delivery of their products—reliably and at lower cost.

Want to learn more about the I-PAT^® automated, inline die screening solution for 8 Series? Click here.

Click here to download the 8930 fact sheet for SiC/GaN semiconductors.

CAPRES CIPTech^®

CAPRES CIPTech^®

Electrical / Magnetic Property Metrology

The CAPRES A301 CIPTech^® and CAPRES CIPTech-M300 metrology systems measure the critically important magneto-resistance and tunneling resistance (MR and RA) directly on blanket Magnetic Tunnel Junction (MTJ) stacks in regimes relevant for MRAM, STTRAM, magnetic recording head, and magnetic sensor applications. Current In-Plane Tunneling Technology (CIPTech), licensed from IBM, offers unprecedented measurement speed and radical cost and time-savings over previous techniques. When combined with CAPRES proprietary nano-MEMS probing technology, the fully automated A301, and semi-automated / manual M300 systems enable non-destructive measurement of MTJ properties quickly and effectively on 300mm full wafers or sample coupons. The MTJ surface is probed by a novel multi-point contact probe with twelve microscopic cantilever electrodes and CIPT is used to automatically extract MR and RA directly from the CAPRES multi-point measurements.

MicroSense^® KerrMapper

MicroSense^® KerrMapper

Longitudinal Magneto-Optic Kerr Effect System

The KerrMapper family of tools utilizes the longitudinal Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of magnetic multi-layer wafers for data storage, MRAM, and other magnetic sensors. Utilizing a non-contact full-wafer measurement technique, the KerrMapper S300 and V300 systems create a map of the magnetic properties of entire wafers. Both systems are available in a manual-loading or fully-automated configuration for use in R&D and/or production. Using the proprietary direct field control technique of MicroSense magnetic metrology tools, KerrMapper systems offer high field capabilities and low field resolution to characterize free and pinned layer properties in a single system.

Candela^® 8xxx

VCSEL array image courtesy of Philips Photonics

Candela^® 8xxx

Advanced Surface Inspection for Compound Semiconductor Materials

The Candela^® 8720 compound semiconductor material surface inspection system enables GaN-related materials, GaAs substrate and epi process control with high sensitivity to critical defects for production of power devices, communications and RF devices, and advanced LEDs (as well as upcoming microLEDs). With its proprietary optical design and detection technology, the Candela 8720 detects and classifies sub-micron defects that are not consistently identified by current inspection methods, supporting production-line monitoring for yield-limiting defects.

Candela^® 8520

Candela^® 8520

Defect Inspection Solution for SiC and GaN Substrates

The Candela^® 8520 defect inspection system is designed for advanced characterization of SiC and GaN substrates, often used for power devices in automotive and other applications. Integrated surface scattering and photoluminescence inspection technologies capture a wide variety of mission-critical topographic and crystallographic defects, like triangles, carrots, stacking faults and basal plane dislocations. The Candela 8520 system helps substrate manufacturers improve quality and yield, and optimize their epitaxial growth processes. Better substrates can improve power device yield and reliability. Read more about the Candela 8520 here.

Candela^® 71xx

Candela^® 71xx

Hard Disk Drive Media and Substrates Defect Inspection and Classification Systems

The Candela^® 71xx Series advanced media and substrate defect detection and classification system for hard disk drive manufacturing helps maximize yield and lower hard disk inspection cost. A dual optical path configuration enables classification of unique defect signatures for critical submicron defects, such as micro-pits, bumps, particles and buried defects. The Candela 7110 configuration supports manual loading of substrates for inspection, while the Candela 7140 provides fully automated cassette-to-cassette substrate loading.

A high sensitivity (HS) option provides enhanced sensitivity and capture rate for both bare glass and metal substrate inspection.

Candela^® 63xx

Candela^® 63xx

Hard Disk Drive Media and Substrates Topography Measurement and Defect Inspection System

The Candela^® 63xx dual laser-based inspection system provides surface inspection of hard disk drive substrates and finished media. Its unique multi-channel optical design enables roughness and waviness metrology measurements on both smooth metal and glass substrates. Defects, such as particles and scratches, can be automatically detected and classified using the same platform. The Candela 6310 is a manual system suited for both laboratory and low volume production, while the Candela 6340 is a fully automated cassette-to-cassette system for production environments.

MicroSense^® CSW1

MicroSense^® CSW1

150mm/200mm Wafer Geometry System

The MicroSense^® CSW1, formerly known as the UltraMap UMA-C200, is a bare wafer geometry measurement system used by wafer manufacturers to qualify sawn, polished and epitaxial 150mm and 200mm silicon and SiC substrates and others including GaN, GaAs, sapphire and epitaxy processes. As a bridge tool with two cassettes, the CSW1 can simultaneously accommodate both 150 and 200mm wafers. Patented dual probe, non-contact capacitance sensors with nanometer resolution offer precise and accurate automated geometry measurements at high throughout. System output includes high density 2D and 3D maps of thickness, flatness, shape, site flatness and edge metrics.

Click here to download the MicroSense^® CSW1 brochure.

MicroSense^® BP1

MicroSense^® BP1

150mm and 200mm Wafer Geometry System

The MicroSense^® BP1, formerly known as the UltraMap UMA-200-BP, is a bare wafer geometry measurement system used by wafer manufacturers to qualify sawn, polished and epitaxial silicon and SiC substrates and others including GaN, GaAs, sapphire and epitaxy processes. Wafers and substrates can be round or square and measure up to 200mm in extent. A variety of wafer holders are available. The BP1 precisely measures wafer thickness, flatness and shape using two patented, non-contact, high resolution, auto-positioning back pressure probes. The BP1 is an extremely flexible system that can measure a wide range of wafer thicknesses and any wafer material. Wafer surface finish has no effect on the measurement - the tool measures sawn, lapped or polished wafers.

Click here to download the MicroSense^® BP1 brochure.

MicroSense^® DiskMapper H8

MicroSense^® DiskMapper H8

Non-destructive, Non-contact Double-sided Mapping of HAMR/TAR Media

The DiskMapper H8 system quickly determines the uniformity of the perpendicular recording layer of Heat Assisted Magnetic Recording (HAMR), also called Thermally Assisted Recording (TAR) disks, immediately after deposition, an important factor in the yield of disk drives. Utilizing a custom 8 Tesla bi-polar high-speed superconducting magnet, the hysteresis loop of any disk location can be measured in less than 3 minutes. By using full cassette automation and double-sided measurement capability, the DiskMapper H8 system is both an R&D and production tool.

MicroSense^® Polar Kerr

MicroSense^® Polar Kerr

The MicroSense^® Polar Kerr system characterizes the magnetic properties of the perpendicular magnetic recording (PMR) layer immediately after deposition for rapid process feedback in manufacturing disk drive media. The full disk, non-destructive, non-contact measurement technique, and automated handling make the system a powerful tool for both PMR development and production monitoring. By quickly and accurately measuring the magnetic parameters crucial to PMR media performance, the MicroSense Polar Kerr system improves the ability to control the complex film deposition process and drive product yield improvement.

SensArray^® Process Probe™ 2070

SensArray^® Process Probe™ 2070

In Situ Flat Panel Temperature Monitoring System

The Process Probe™ 2070 instrumented glass tiles offer a cost-effective and flexible solution for reliable, in situ characterization of glass temperature profiles for many flat panel processing applications. Employing a number of small instrumented glass tiles rather than a single large panel of glass, the Process Probe 2070 allows the thermocouple sensors to be easily placed at desired locations on the susceptor within the process chamber. This flexible product design simplifies temperature measurements for LCD and other large-generation glass panel applications, enabling high accuracy process qualification and optimization.

Klarity^®

Klarity^®

Automated Defect and Yield Data Analysis

Klarity^® Defect automated defect analysis and data management system helps fabs achieve faster yield learning cycles through real-time excursion identification. Klarity^® SSA (Spatial Signature Analysis) analysis module for Klarity Defect provides automatic detection and classification of defect signatures that indicate process issues. Klarity^® ACE XP advanced yield analysis system helps fabs capture, retain and share yield learning within and across fabs for yield acceleration. Klarity systems utilize an intuitive decision flow analysis, allowing engineers to easily create customized analyses that support applications such as lot dispositioning, review sampling, defect source analysis, SPC setup and management, and excursion notifications. Klarity Defect, Klarity SSA and Klarity ACE XP form a fab-wide yield solution that automatically reduces defect inspection, classification and review data to relevant root-cause and yield-analysis information. Klarity data helps IC, packaging, compound semi and HDD manufacturers take corrective action sooner, resulting in accelerated yield and better time to market.

Profiler Portfolio

Profiler Portfolio

Optical and Stylus Profilers

KLA offers a range of stylus and optical profilers that support surface metrology measurements for semiconductor IC, power device, LED, photonics, MEMS, CPV solar, HDD and display manufacturing. Please visit our profilers site for more details.

Nanomechanical Tester Portfolio

Nanomechanical Tester Portfolio

Nanomechanical Testers for Compound Semiconductor Manufacturing

KLA’s nanomechanical testers support microscale and nanoscale mechanical testing for semiconductor and MEMS industries. Please visit our nanomechanical testers site for more details.