Sigma® fxP – Metal Deposition for WLP

Jun 15, 2021

Talking Poster (with captions) – Introduction to the benefits of using the Sigma® fxP for metal deposition in fan-out wafer level packaging (FOWLP). Key features include a multi-wafer degas for in-situ degas a large batch of mold wafer within the system avoiding exposure to atmosphere before processing while significantly improving throughput, and unique pre-clean technology ensures extremely low (and importantly stable) contact resistance. (5mins:04secs)

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