Talking Poster (with captions) – Introduction to the benefits of using the Sigma^® fxP for metal deposition in fan-out wafer level packaging (FOWLP). Key features include a multi-wafer degas for in-situ degas a large batch of mold wafer within the system avoiding exposure to atmosphere before processing while significantly improving throughput, and unique pre-clean technology ensures extremely low (and importantly stable) contact resistance. (5mins:04secs)