Omega® Etch for Advanced Packaging

Jun 15, 2021

Introduction to blanket silicon etching for Advanced Packaging applications, including via reveal and wafer thinning with etch rates adjustable across the wafer to compensate for incoming non-uniformities

Are you sure?

You've selected to view this site translated by Google Translate.
KLA China has the same content with improved translations.

Would you like to visit KLA China instead?



If you are a current KLA Employee, please apply through the KLA Intranet on My Access.