Mosaic® fxP – Plasma Dicing

Jun 15, 2021

Plasma dicing offers an alternative method of singulating individual chips from a silicon wafer, after processing. It offers particular advantages over conventional mechanical sawing or laser dicing when dicing very small or delicate devices. In such cases it can significantly improve throughputs and increase die strength/yields. It also has the added benefit of producing no particulate contamination which is important in applications such as hybrid bonding.

Are you sure?

You've selected to view this site translated by Google Translate.
KLA China has the same content with improved translations.

Would you like to visit KLA China instead?



If you are a current KLA Employee, please apply through the KLA Intranet on My Access.