eSL10™ e-Beam Wafer Defect Inspection System

May 14, 2021

Today’s leading-edge ICs are fabricated using intricate shapes and new materials, with structures that are smaller, narrower, taller and deeper. This complexity demands innovative defect inspection solutions. The eSL10™ e-beam patterned wafer defect inspection system captures and identifies defects not found by other inspectors, reducing the cycle time required for solving critical yield or reliability issues. By providing a deep understanding of critical defects early in the chip manufacturing process, the eSL10 helps accelerate time-to-market for innovative electronic devices. Learn more at

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