Delta® PECVD for Advanced Packaging

Jun 15, 2021

Talking Poster (with captions) – Introduction to plasma enhanced chemical vapor deposition for Advanced Packaging applications, such as via reveal passivation, hybrid bonding and via-last TSV passivation. The Delta® fxP PECVD system offers dielectric deposition at low temperatures (<100°C) which is important for bonded wafers or mold substrates. The system can offer single or multi wafer degas options, and deposits high quality dielectric films with controllable stress levels, which do not degrade over time. (4 mins)

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