Introducing the new Orbotech Corus™ 8M double-sided direct imaging (DI) solution

Oct 24, 2022

Introducing the new Orbotech Corus™ 8M double-sided direct imaging (DI) solution, the first system built on the all-in-one revolutionary Orbotech Corus platform, combining the functionality and automation of an entire direct imaging production line in a closed, clean and compact unit.  Providing increased resolution with high accuracy to pattern finer lines, the extendable and efficient Orbotech Corus DI platform will support continued innovation for advanced high-density interconnect PCBs and IC substrates.

Are you sure?

You've selected to view this site translated by Google Translate.
KLA China has the same content with improved translations.

Would you like to visit KLA China instead?


您已选择查看由Google翻译翻译的此网站。
KLA中国的内容与英文网站相同并改进了翻译。

你想访问KLA中国吗?

If you are a current KLA Employee, please apply through the KLA Intranet on My Access.

Exit