KLA is proud to announce our sponsorship of the US International Semiconductor Executive Summit.
KLA’s Oreste Donzella will present “Optimizing Interconnect Density with New Packaging Technologies”.
The US International Semiconductor Executive Summits seeks to strengthen the US supply chain and promote key executives in the semiconductor manufacturing, design, and research through our networking and conference platform which consists of working with key industry stakeholders to encourage progress and collaboration.
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