KLA is looking forward to meeting you at NEPCON Japan. Please visit our booth where we will present solutions for the advanced PCB and IC substrate, and Industry 4.0 software solutions that would visualize the inspection results.

The NEPCON Japan is Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology. The show will feature technologies and products related to SMT, electronics testing, IC and sensor packaging, electronics components and materials, printed circuit boards, 5G, and fine process technologies.