Loading Events


KLA is looking forward to meeting you at NEPCON Japan. Please visit our booth where we will present solutions for the advanced PCB and IC substrate, and Industry 4.0 software solutions that would visualize the inspection results.

The NEPCON Japan is Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology. The show will feature technologies and products related to SMT, electronics testing, IC and sensor packaging, electronics components and materials, printed circuit boards, 5G, and fine process technologies.

Back to Events

Related Products


Electron-beam wafer defect review and classification system for ≤10nm design node IC development and production. The eDR7xxx™ provides unique linkage to KLA inspectors for faster yield learning during IC and wafer manufacturing.

Learn More

Are you sure?

You've selected to view this site translated by Google Translate.
KLA China has the same content with improved translations.

Would you like to visit KLA China instead?



If you are a current KLA Employee, please apply through the KLA Intranet on My Access.