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KLA Docu-Series: The Toughest Problems Solved by Engineers for Axion® T2000

Dec 13, 2022 1 min read

What is the toughest problem you ever solved? For a team of engineers and scientists in KLA’s metrology division, the toughest problem they faced involved work on our Axion® T2000 X-ray metrology system.

This team harnessed the power of X-rays, refined AI (artificial intelligence)-based algorithms and developed patented technologies to produce a fab-ready system that measures high-aspect ratio memory device features with unprecedented resolution, accuracy, precision and speed. The resulting Axion T2000 discovers the small 3D shape anomalies that can impact advanced 3D NAND and DRAM performance, helping to ensure successful production of memory chips.  

The video below features KLA engineers discussing the hardest problems they faced – and solved! – while working on the Axion product.

Are you interested in tackling complex technical challenges and exploring the edges of optics, sensors, mechanics, AI and data analytics? Explore KLA’s careers and join our engineering team.

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